Quantum Automation Series System Specifications
(Original Document)
About us
Overview
This section presents the specifications for the Quantum Automation Series.
Specification Table
All Quantum Automation Series modules are designed to the following system specifications. Also included in this section are agency approvals.
Mechanical
Mechanical
Weight
2 lbs (1 kg) max
Dimensions (H x D x W)
9.84 in. x 4.09 in. x 1.59 in (250 mm x 103.85 mm x 40.34 mm)
Wire Size
1—14 AWG or 2—16 AWG max; 20 AWG min
Material (Enclosures and Bezels)
Lexan
Space Requirements
1 backplane slot
Electrical
Electrical
RFI Immunity (IEC 801-3)
27...500 MHz, 10 V/m
Electrostatic discharge (IEC 801-2)
8 kV air/4 kV contact
Modules with Operating Voltages Less than 24 Vac or Vdc
Function I/O Modules with Operating Voltages Less than 24 Vac or Vdc
Fast Transients (IEC 801-4)
0.5 kV common mode
Damped Oscillatory Transients
1 kV common mode; 0.5 kV differential mode
Surge Withstand Capability (Transients) (IEC 801-5)
1 kV common mode; 0.5 kV differential mode
Operating Conditions
Operating Conditions
Temperature
0...60°C (32...140°F)
Humidity
0..95% RH noncondensing @ 60°C
Chemical Interactions
Enclosures and bezels are made of Lexan, a polycarbonate that can be damaged by strong alkaline solutions
Altitude
2000 meters full operation
Vibration
10...57 Hz @ 0.075 mm d.a.; 57...150 Hz @ 1 g
Shock
15 g peak, 11 ms, half-sine wave
Storage Conditions
Storage Conditions
Temperature
-40...85°C (-40...185°F)
Humidity
0...95% RH noncondensing @ 60°C
Free Fall
3 ft (1 m)
Agency Approvals
Agency Approvals
UL 508
CSA 22.2-142
Factory Mutual Class I, Div. 2
European Directive on EMC 89/336/EEC