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Discrete I/O Module Specifications
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(Original Document)
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Discrete I/O Module Specifications
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(Original Document)
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Operating
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Temperature
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0 - 60°C (32 to 140°F)
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Humidity
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0 - 95% (noncondensing) at 60°C
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Storage
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Temperature
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-40 - 85°C (32 to 140°F)
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Humidity
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0 - 95% (noncondensing) at 60°C
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Isolation
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Field to System
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2000 VAC steady state maximum at 60 Hz for 1 min.
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Between Groups
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2500 VDC for 60 s without breakdown. Leakage current shall not exceed 1.5 mA.
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Shock
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Operating
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15 G peak, 11 ms, half sine wave
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Nonoperating
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15 G peak, 11 ms, half sine wave
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Vibration
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Operating
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0.005 in D.A.
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Sine from 10 to crossover frequency (57 - 62 Hz)
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1.0 G from crossover frequency to 50 Hz
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Nonoperating
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0.029 G sq/Hz, 10 - 50 Hz rolloff at -8dB/octave from 50 - 500 Hz
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EMI
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MIL-STD 461B
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RFI
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FCC Class A
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Surge Withstand Capability
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IEEE 472-1974 and ANSI C37.90A-1974)
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Dimensions (W x H x D)
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50.8 x 266.7 x 203.2 mm (2.0 x 10.5 x 8.0 in)
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Weight
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1.1 kg (2.4 lb)
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Space Required
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1 I/O slot
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