EMC functions of the grounding system
The grounding system has the following tasks with regard to EMC:
Interference current dissipation
Prevent couplings
Maintaining shielding at specific potentials
The grounding system must fulfill these requirements without interfereing with the device and wiring.
Effect of grounding
The galvanic coupling is affected by the ground connection. Disturbances can spread via the grounding system across the entire plant if the grounding system is poorly configured or bad connections are made.
EMC measures for grounding systems
The following EMC arrangements are available for grounding systems:
Optimal selection and combination of grounding systems (point-to-point or meshed) if necessary
Meshed grounding: sufficiently small surface area of the loop between exposed conductive parts
Sufficient cross-section of the earth conductors low-resistance and low-inductance lines and therefore an effective equipotential bonding for low and high frequency signals
Good chassis connection to decrease the contact resistance
Types of grounding systems
Two types of grounding systems are used:
S Type: Point-to-point
M Type: Grid-type
Large plants use both grounding types in combination as they have varying effectiveness depending on the application. The advantages and disadvantages of each system are described below.
S type grounding system
With point-to-point grounding of reference conductors, every reference conductor to be grounded in a circuit is only connected once to ground at a central point.
Point-to-point grounding system

Advantages and disadvantages of point-to-point grounding
Advantages of point-to-point grounding for reference conductors
Reference conductors cannot be coupled and disturbance caused by induced voltages is not possible at low-frequencies
At low-frequencies, no or only slightly different potential differences between ground and reference conductor can occur.
Disadvantages of point-to-point grounding for reference conductors
A point-to-point grounding system can only be achieved at high cost due to additional isolation.
High-frequency coupling are possible.
Different conventional reference potentials can occur at high frequencies.
Isolated arrangement of device chassis is required against the reference conductor.
Grounding system type M
With grid type grounding, the reference conductors are connected multiple times to the chassis connection. This creates a meshed system.
The connections are arranged between the devices ground, cable runs, existing or under construction metal structures etc. Shielding, filtering devices return conductors, etc. are directly connected to this cable.
Grid-type grounding system

Advantages and disadvantages of meshed grounding
Advantages of meshed grounding for reference conductors
Lower potential difference for high-frequency disturbance within the grounding system
No isolated arrangement of device chassis is required against the reference conductor.
Disadvantages of meshed grounding for reference conductors
Galvanic couplings between different circuits via common impedance and currents is possible as a consequence of the induced voltage in the conductor loop.